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TH8080 sololin transceiver TH8080 C datasheet page 1 of 23 3901008080 june 2009 rev 00 7 features features features features compatible to lin specification version 1.3 and 2.0 compatible to iso9141 functions baud rate up to 20 kbaud operating voltage v s = 7 to 18 v low current consumption of typ. 24a wake-up via lin bus traffic slew rate control for good eme behavior high emi immunity fully integrated receiver filter bus terminals proof against short-circuits and tran sients in the automotive environment high impedance bus pin in case of loss of ground an d undervoltage condition high signal symmetry for using in rc C based slave nodes up to 2% clock tolerance automotive temperature range of C40c to 125c cmos compatible interface to microcontroller thermal overload protection load dump protection (40v) 4kv esd protection small soic8 package ordering information part no. temperature range package TH8080 kdc k (-40 to 125 c) dc (soic8) general description general description general description general description the TH8080 is a physical layer device for a single wire data link capable of operating in applications where high data rate is not required and a lower data rat e can achieve cost reductions in both the physical media components and in the microprocessor which use the network. the TH8080 is designed in accordance to th e physical layer definition of the lin protocol speci fication, rev. 1.3 and 2.0.the ic furthermore can b e used in iso9141 systems. because of the very low current consumption of the TH8080 in recessive state its suitable for ecu applications with hard standby current requirements , whereby no sleep/wake up control from the microprocessor is necessary.
TH8080 sololin transceiver TH8080 C datasheet page 2 of 23 3901008080 june 2009 rev 00 7 contents contents contents contents 1. functional diagram ................................. ................................................... ................4 2. electrical specification ........................... ................................................... ................5 2.1 operating conditions............................... ................................................... ...........5 2.2 absolute maximum ratings ........................... ................................................... .....5 2.3 static characteristics............................. ................................................... .............6 2.4 dynamic characteristics ............................ ................................................... .........7 2.5 timing diagrams .................................... ................................................... ............8 2.6 test circuits for dynamic and static characteristic s .............................................9 3. functional description............................. ................................................... .............10 3.1 initialization..................................... ................................................... ..................10 3.2 operating modes .................................... ................................................... ..........10 3.3 lin bus transceiver................................ ................................................... ........10 4. operating under disturbance ........................ ................................................... .......12 4.1 loss of battery .................................... ................................................... ..............12 4.2 loss of ground ..................................... ................................................... ............12 4.3 short circuit to battery........................... ................................................... ............12 4.4 short circuit to ground ............................ ................................................... ..........12 4.5 thermal overload................................... ................................................... ...........12 4.6 undervoltage vcc ................................... ................................................... ..........12 5. application hints .................................. ................................................... .................13 5.1 bus loading requirements........................... ................................................... ......13 5.2 min/max slope time calculation..................... ................................................... ....14 5.3 duty cycle calculation ............................. ................................................... ........15 5.4 application circuitry.............................. ................................................... ............16 6. pin description .................................... ................................................... ..................17 7. mechanical specification soic8 ..................... ................................................... .....18 8. tape and reel specification ........................ ................................................... .........19 8.1 tape specification ................................. ................................................... ...........19 8.2 reel specification................................. ................................................... ............20 9. esd/emc remarks .................................... ................................................... ............21 9.1 general remarks .................................... ................................................... .........21 9.2 esd-test ........................................... ................................................... ...............21 9.3 emc ................................................ ................................................... .................21 10. assembly information ............................... ................................................... ........22 11. disclaimer......................................... ................................................... ..................22
TH8080 sololin transceiver TH8080 C datasheet page 3 of 23 3901008080 june 2009 rev 00 7 list of figures list of figures list of figures list of figures figure 1 - block diagram ........................... ................................................... ........................................... 4 figure 2 C transmit delay .......................... ................................................... ........................................... 8 figure 3 C receiver debouncing and propagation dela y.................................................. ....................... 8 figure 4 - test circuit for dynamic characteristics ................................................... ................................ 9 figure 5 - test circuit for automotive transients .. ................................................... ................................. 9 figure 6 - receive impulse diagram................. ................................................... .................................. 11 figure 7 - slope time calculation .................. ................................................... ...................................... 14 figure 8 - duty cycle calculation in accordance to lin 2.0 ............................................ ....................... 15 figure 9 - application circuitry ................... ................................................... ........................................ 16 figure 10 - pin description soic8 package .......... ................................................... ............................. 17
TH8080 sololin transceiver TH8080 C datasheet page 4 of 23 3901008080 june 2009 rev 00 7 1. 1.1. 1. functional diagram functional diagram functional diagram functional diagram slew rate bus driver biasing and bandgap vs supply and references receive comparator input filter TH8080 thermal protection bus gnd por txd rxd vcc 30k figure 1 - block diagram
TH8080 sololin transceiver TH8080 C datasheet page 5 of 23 3901008080 june 2009 rev 00 7 2. 2.2. 2. elec elec elec electrical specification trical specification trical specification trical specification all voltages are referenced to ground (gnd). positi ve currents flow into the ic. the absolute maximum ratings (in accordance with ie c 134) given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. long term exposure to limiting values may effect the reliabil ity of the device. 2.1 operating conditions parameter symbol min max unit battery supply voltage [1] v s 7 18 v supply voltage v cc 4.5 5.5 v operating ambient temperature t amb 40 +125 c [1] vs is the ic supply voltage including voltage drop of reverse battery protection diode, v drop = 0.4 to 1v, v bat_ecu voltage range is 8 to 18v 2.2 absolute maximum ratings parameter symbol condition min max unit t < 1 min 30 battery supply voltage v s load dump, t < 500ms 0.3 40 v supply voltage v cc 0.3 +7 v transient supply voltage v s.tr1 iso 7637/1 pulse 1 [1] 150 v transient supply voltage v s..tr2 iso 7637/1 pulses 2 [1] 100 v transient supply voltage v s..tr3 iso 7637/1 pulses 3a, 3b 150 150 v t < 500ms , vs = 18v 27 bus voltage v bus t < 500ms ,vs = 0v 40 40 v transient bus voltage v bus..tr1 iso 7637/1 pulse 1 [2] 150 v transient bus voltage v bus.tr2 iso 7637/1 pulses 2 [2] 100 v transient bus voltage v bus.tr3 iso 7637/1 pulses 3a, 3b [2] 150 150 v dc voltage on pins txd, rxd v dc 0.3 7 v esd capability of pin lin,vs esd hb human body model, equivalent to discharge 100pf with 1.5k w , 4 4 kv esd capability of pin rxd, txd, vcc esd hb human body model, equivalent to discharge 100pf with 1.5k w , 2 2 kv maximum latch up free current at any pin i latch 500 500 ma thermal impedance q ja in free air 152 k/w storage temperature t stg 55 +150 c junction temperature t vj 40 +150 c [1] iso 7637 test pulses are applied to vs via a re verse polarity diode and >2uf blocking capacitor. [2] iso 7637 test pulses are applied to bus via a c oupling capacitance of 1 nf.
TH8080 sololin transceiver TH8080 C datasheet page 6 of 23 3901008080 june 2009 rev 00 7 2.3 static characteristics unless otherwise specified all values in the follow ing tables are valid for v s = 7 to 18v, v cc = 4.5 to 5.5v and t amb = -40 to 125c. all voltages are referenced to grou nd (gnd), positive currents are flow into the ic. parameter symbol condition min typ max unit pin vs, vcc v cc undervoltage lockout v cc_uv v s > 7v, txd=l 2.75 4.3 v supply current, dominant i sd v s = 18v,v cc = 5.5v, txd = l 1 3 ma supply current, dominant i ccd v s = 18v,v cc = 5.5v, txd = l 0.8 1.5 ma supply current, recessive i sr v s = 18v,v cc = 5.5v,txd=open 10 20 a supply current, recessive i ccr v s = 18v,v cc = 5.5v,txd=open 18 30 a supply current, recessive i sr + i ccr v s = 12v,v cc = 5v, txd=open, t amb = 25 24 a pin bus C transmitter short circuit bus current [2] [3] i bus_lim v bus = v s , driver on 120 200 ma pull up current bus [2] [3] i bus_pu v bus = 0, v s = 12v, driver off 600 200 ma bus reverse current, recessive [2] [3] i bus_pas_rec v bus > v s , 7v < v bus < 18v 7v < v s < 18v, driver off 5 a bus reverse current loss of battery [2] [3] i bus v s = 0v, 0v < v bus < 18v 5 a bus current during loss of ground [2] [3] i bus_no_gnd v s = 12v, 0 < v bus < 18v 1 1 ma transmitter dominant voltage [1] [2] v busdom_drv_2 vs = 7v, load = 500 w 1.2 v transmitter dominant voltage [2] v busdom_drv_3 v s = 18v, load = 500 w 2 v bus input capacitance [1] c bus pulse response via 10k w , v pulse =12v, v s open 25 35 pf pin bus C receiver receiver dominant voltage [2] [3] v busdom 0.4 *v s v receiver recessive voltage [2] [3] v busrec 0.6 *v s v center point of receiver threshold [1] [2] [3] v bus_cnt v bus_cnt = (v busdom + v busrec )/2 0.487 *v s 0.5 *v s 0.512 *v s v receiver hysteresis [1] [2] [3] v hys v bus_cntt = ( v busrec v busdom ) 0.175 *v s 0.187 *v s v pin txd high level input voltage v ih rising edge 0.7*v cc v low level input voltage v il falling edge 0.3*v cc v txd pull up resistor r ih_txd v txd = 0v 10 15 25 k w pin rxd low level output voltage v ol_rxd i rxd = 2ma 0.9 v leakage current v leak_rxd v rxd = 5.5v, recessive 10 10 a
TH8080 sololin transceiver TH8080 C datasheet page 7 of 23 3901008080 june 2009 rev 00 7 parameter symbol condition min typ max unit thermal protection thermal shutdown t sd [1] 155 180 c thermal recovery t hys [1] 126 150 c [1] no production test, guaranteed by design and qu alification [2] in accordance to lin physical layer specificati on 1.3 [3] in accordance to lin physical layer specificati on 2.0 2.4 dynamic characteristics unless otherwise specified all values in the follow ing table are valid for v s = 7 to 18v and t amb = -40 to 125 o c. parameter symbol condition min typ max unit propagation delay transmitter [1] [3] [7] t trans_pd bus loads: 1k w /1nf, 660 w /6.8nf, 500 w /10nf 5 s propagation delay transmitter symmetry [3] [7] t trans_sym calculate t trans_pdf t trans_pdr 2 2 s propagation delay receiver [1] [5] [6] [7] [8] t rec_pdf c rxd = 25pf 6 s propagation delay receiver symmetry [7] [8] t rec_sym calculate t trans_pdf t trans_pdr 2 2 s slew rate rising and falling edge, high battery [4] [7] |t sr_hb | bus load 1k w /1nf; 660 w /6.8nf; 500 w /10nf v s = 18v 1 2 3 v/s slew rate rising and falling edge, low battery [4] [7] |t sr_lb | bus load 1k w /1nf; 660 w /6.8nf; 500 w /10nf v s = 7v 0.5 2 3 v/s slope symmetry, high battery [4] [7] t ssym _ hb bus load 1k w /1nf; 660 w /6.8nf; 500 w /10nf v s = 18v calculate t sdom C t srec 5 +5 s bus duty cycle 1 [8] [9] d1 calculate t bus_rec(min) / 100s 0.396 bus duty cycle 2 [8] [9] d2 calculate t bus_rec(max) / 100s 0.581 receiver debounce time [2] [5] [6] t rec_deb bus rising and falling edge 1.5 4 s [1] propagation delays are not relevant for lin pro tocol transmission, value only information paramete r [2] no production test, guaranteed by design and qu alification [3] see figure 2 C transmit delay [4] see figure 7 - slope time and slew rate calcula tion in accordance to lin 1.3 [5] this parameter is tested by applying a square w ave signal to the bus. the minimum slew rate for th e bus rising and falling edges is 50v/us [6] see figure 3 C receiver debouncing and propagat ion delay [7] in accordance to lin physical layer specificati on 1.3 [8] in accordance to lin physical layer specificati on 2.0 [9] see figure 8 - duty cycle calculation in accord ance to lin 2.0
TH8080 sololin transceiver TH8080 C datasheet page 8 of 23 3901008080 june 2009 rev 00 7 2.5 timing diagrams txd bus t trans_f rxd v bus 95% t trans_r 5% 100% 0% 50% figure 2 C transmit delay v rxd v bus t rec_pdr 50% t t t rec_pdf t < t rec_deb t < t rec_deb figure 3 C receiver debouncing and propagation dela y
TH8080 sololin transceiver TH8080 C datasheet page 9 of 23 3901008080 june 2009 rev 00 7 2.6 test circuits for dynamic and static characteri stics vs bus gnd vcc rxd txd TH8080 r l 100n c l 100n 20p 2.7k figure 4 - test circuit for dynamic characteristics vs bus gnd vcc rxd txd TH8080 500 2uf 1nf 100n schaffner- generator 12v puls1,2,4 puls3a,3b oszi figure 5 - test circuit for automotive transients
TH8080 sololin transceiver TH8080 C datasheet page 10 of 23 3901008080 june 2009 rev 00 7 3. 3.3. 3. functional description functional description functional description functional description 3.1 initialization after power on, the chip enters automatically the recessive state. if the voltage regulator provides the v cc C supply voltage, normal communication is possible. 3.2 operating modes all operation modes will be handled from the TH8080 automatically. normal mode after power on, the ic switches automatically to no rmal mode. bus communication is possible. if there is no communication on the bus line the po wer consumption of the ic is very low and therefore it is no standby management from the mcu necessary. thermal shutdown mode if the junction temperature t j is higher than 155c, the TH8080 will be switched into the thermal shutdown mode (bus driver will be switched off). if t j falls below the thermal shutdown temperature (typ. 140c) the TH8080 will be switched to the normal mode. 3.3 lin bus transceiver the transceiver consists a bus-driver with slew rat e control, current limitation and as well in the re ceiver a high voltage comparator followed by a debouncing un it. bus input/output the recessive bus level is generated from the integ rated 30k pull up resistor in serial with a diode t his diode prevent the reverse current of v bus during differential voltage between vs and bus (v bus >v s ). no additional termination resistor is necessary to use the TH8080 in lin slave nodes. if this ic is us ed for lin master nodes it is necessary that the bus pin i s terminated via a external 1k w resistor in serial with a diode to vbat. txd input during transmission the data at the pin txd will be transferred to the bus driver for generatin g a bus signal. to minimize the electromagnetic emission of the bus line, the bus driver is equipped with an integrate d slew rate control and wave shaping unit. transmitting will be interrupted if thermal shutdow n is active. the cmos compatible input txd controls directly the bus level: txd = low -> bus = low (dominant level) txd = high -> bus = high (recessive level) the txd pin has an internal pull up resistor connec ted to vcc. this secures that an open txd pin gener ates a recessive bus level.
TH8080 sololin transceiver TH8080 C datasheet page 11 of 23 3901008080 june 2009 rev 00 7 rxd output the data signals from the bus pin will be transferr ed continuously to the pin rxd. short spikes on the bus signal are suppressed by the implemented debouncing circuit. bus rxd t < t rec_deb t < t rec_deb vs 50% 60% 40% v hhys v bus_cnt_max v bus_cnt_min figure 6 - receive impulse diagram the receive threshold values v bus_cnt_max and v bus_cnt_min are symmetrical to the centre voltage of 0.5*v s with a hysteresis of typ. 0.175*v s . including all tolerances the lin specific receive threshold values of 0.4*v s and 0.6*v s will be secure observed. the received bus signal will be output to the rxd p in: bus < v bus_cnt C 0.5 * v hys -> rxd = low (bus dominant) bus > v bus_cnt + 0.5 * v hys -> rxd = high, floating (bus recessive) this pin is a buffered open drain output with a typ ical load of: resistance: 2.7 kohm capacitance: < 25 pf datarate the TH8080 is a constant slew rate transceiver that means the bus driver operates wit h a fixed slew rate range of 0.5 v/s d v/ d t 3v/s. this principle secures a very good symmetry of the slope times between recessive to dominant and dominant to recessive slo pes within the lin bus load range (c bus , r term ). the TH8080 guarantees data rates up to 20kbit withi n the complete bus load range under worst case conditions. the constant slew rate principle is ver y robust against voltage drops and can operate with rc- oscillator systems with a clock tolerance up to 2% between 2 nodes.
TH8080 sololin transceiver TH8080 C datasheet page 12 of 23 3901008080 june 2009 rev 00 7 4. 4.4. 4. operating under disturbance operating under disturbance operating under disturbance operating under disturbance 4.1 loss of battery if the ecu is disconnected from the battery, the bu s pin is in high impedance state. there is no impac t to the bus traffic and to the ecu itself. 4.2 loss of ground in case of an interrupted ecu ground connection the re is no influence to the bus line. 4.3 short circuit to battery the transmitter output current is limited to the sp ecified value in case of short circuit to battery i n order to protect the TH8080 itself against high current dens ities . 4.4 short circuit to ground if the bus line is shorted to negative shifted grou nd levels, there is no current flow from the ecu gr ound to the bus and no distortion of the bus traffic occurs . 4.5 thermal overload the TH8080 is protected against thermal overloads. if the chip temperature exceeds the specified value , the transmitter is switched off until thermal recovery. the receiver is still working while thermal shutdo wn. 4.6 undervoltage vcc if the ecu regulated supply voltage is missing or d ecreases under the specified value, the transmitter is switched off to prevent undefined bus traffic.
TH8080 sololin transceiver TH8080 C datasheet page 13 of 23 3901008080 june 2009 rev 00 7 5. 5.5. 5. application hints application hints application hints application hints 5.1 bus loading requirements parameter symbol min typ max unit operating voltage range v bat 8 18 v voltage drop of reverse protection diode v drop_rev 0.4 0.7 1 v voltage drop at the serial diode in pull up path v serdiode 0.4 0.7 1 v battery shift voltage v shift_bat 0 0.1 v bat ground shift voltage v shift_gnd 0 0.1 v bat master termination resistor r master 900 1000 1100 w slave termination resistor r slave 20 30 60 k w number of system nodes n 2 16 total length of bus line len bus 40 m line capacitance c line 100 150 pf/m capacitance of master node c master 220 pf capacitance of slave node c slave 195 220 300 pf total capacitance of the bus including slave and ma ster capacitance c bus 0.47 4 10 nf network total resistance r network 500 862 w time constant of overall system t 1 5 m s table 1 - bus loading requirements
TH8080 sololin transceiver TH8080 C datasheet page 14 of 23 3901008080 june 2009 rev 00 7 5.2 slope time calculation v bus 60% 40% t sdom 60% 100% 0% t srec v dom 40% figure 7 - slope time and slew rate calculation in accordance to lin 1.3 the slew rate of the bus voltage is measured betwee n 40% and 60% of the output voltage swing (linear region). the output voltage swing is the difference between dominant and recessive bus voltage. dv/dt = 0.2*v swing / (t 40% - t 60% ) the slope time is the extension of the slew rate ta ngent until the upper and lower voltage swing limit s: t slope = 5 * (t 40% - t 60% ) the slope time of the recessive to dominant edge is directly determined by the slew rate control of th e transmitter: t slope = v swing / dv/dt the dominant to recessive edge is influenced from t he network time constant and the slew rate control, because its a passive edge. in case of low battery voltages and high bus loads the rising edge is onl y determined by the network. if the rising edge slew rate exceeds the value of the dominant one, the sle w rate control determines the rising edge.
TH8080 sololin transceiver TH8080 C datasheet page 15 of 23 3901008080 june 2009 rev 00 7 5.3 duty cycle calculation txd bus rxd v sup 58.1% 28.4% 100% 74.4% 42.2% t dom(max) t dom(min) t rec(min) t rec(max) 0% v ss 58.1% 28.4% t bit t bit figure 8 - duty cycle calculation in accordance to lin 2.0 with the timing parameters shown in figure 8 two du ty cycles , based on t rec(min) and t rec(max) can be calculated as follows : d1 = t rec(min) / (2 * t bit ) d2 = t rec(max) / (2 * t bit ) for proper operation at 20kbit/s ( t bit = 50s) the lin driver has to fulfil the duty cycl es specified in chapter 2.4 dynamic characteristics for supply voltages of 7 to 18v and the defined standard loads . due to this simplified definition there is no need to measure slew rates, slope times, transmitter del ays and dominant voltage levels as specified in the lin phy sical layer specification 1.3. the device within the d1/d2 duty cycle range operat es also in applications with reduced bus speed of 10.4kbit/s or below. in order to minimize eme, the slew rates of the tra nsmitter can be reduced (approximately by 2 times). such devices have to fulfil the duty cycle definition d3 /d4 in the lin physical layer specification 2.0. de vices within this duty cycle range cannot operate in 20kbit/s ap plications.
TH8080 sololin transceiver TH8080 C datasheet page 16 of 23 3901008080 june 2009 rev 00 7 5.4 application circuitry 100nf TH8080 rxd voltage regulator (e.g.ncv8502) v bat 10 1n4001 mcu vcc bus 220pf txd gnd vs slave ecu 100nf [1] the th8082 is a pin compatible transceiver with inh control 47nf 2.7k 10 100nf th8082 [1] rxd voltage regulator (e.g.ncv8501) 10 1n4001 mcu vcc bus 220pf txd gnd vs master ecu 100nf 47nf 2.7k 10 vin vout enable inh 1k en reset 47nf lin 10k 10k reset vin vout 10k figure 9 - application circuitry
TH8080 sololin transceiver TH8080 C datasheet page 17 of 23 3901008080 june 2009 rev 00 7 6. 6.6. 6. pin description pin description pin description pin description TH8080 1 2 3 4 8 7 6 5 rxd gnd txd n.c. n.c. vs bus vcc figure 10 - pin description soic8 package pin name io-typ description 1 rxd o receive data from bus to core, low in domin ant state 2 n.c. 3 vcc p 5v supply input 4 txd i transmit data from core to bus, low in domi nant state 5 gnd g ground 6 bus i/o lin bus pin, low in dominant state 7 vs p battery input voltage 8 n.c.
TH8080 sololin transceiver TH8080 C datasheet page 18 of 23 3901008080 june 2009 rev 00 7 7. 7.7. 7. mechanical specification mechanical specification mechanical specification mechanical specification soic8 soic8 soic8 soic8 small outline integrated circiut (soic), soic 8, 150 mil a1 b c d e e h h l a a aa a zd a2 all dimension in mm, coplanarity < 0.1 mm min max 0.10 0.25 0.36 0.46 0.19 0.25 4.80 4.98 3.81 3.99 1.27 5.80 6.20 0.25 0.50 0.41 1.27 1.52 1.72 0 8 0.53 1.37 1.57 all dimension in inch, coplanarity < 0.004 min max 0.004 0.0098 0.014 0.018 0.0075 0.0098 0.189 0.196 0.150 0.157 0.050 0.2284 0.244 0.0099 0.0198 0.016 0.050 0.060 0.068 0 8 0.021 0.054 0.062
TH8080 sololin transceiver TH8080 C datasheet page 19 of 23 3901008080 june 2009 rev 00 7 8. 8.8. 8. tape and reel specification tape and reel specification tape and reel specification tape and reel specification 8.1 tape specification max. 10 top view sectional view max. 10 ic pocket r m i n . w f e cover tape p 0 p 2 d 0 p 1 d 1 < a 0 > b 0 g 2 g 1 t 2 t t 1 b 1 k 0 s 1 abwickelrichtung standard reel with diameter of 13 package parts per reel width pitch soic8 2500 12 mm 8 mm d 0 e p 0 p 2 t max t 1 max g 1 min g 2 min b 1 max d 1 min f p 1 r min t 2 max w 1.5 +0.1 1.75 0.1 4.0 0.1 2.0 0.05 0.6 0.1 0.75 0.75 8.2 1.5 5.5 0.05 4.0 0.1 30 6.5 12.0 0.3 a 0 , b 0 , k 0 can be calculated with package specification. cover tape width 9.2 mm.
TH8080 sololin transceiver TH8080 C datasheet page 20 of 23 3901008080 june 2009 rev 00 7 8.2 reel specification a d* b* c w 2 w 1 n a max b* c d* min 330 2.0 0.5 13.0 +0,5/0,2 20.2 width of half reel n min w 1 w 2 max 4 mm 100,0 4,4 7,1 8 mm 100,0 8,4 11,1
TH8080 sololin transceiver TH8080 C datasheet page 21 of 23 3901008080 june 2009 rev 00 7 9. 9.9. 9. esd/emc remarks esd/emc remarks esd/emc remarks esd/emc remarks 9.1 general remarks electronic semiconductor products are sensitive to electro static discharge (esd). always observe electro static discharge control pro cedures whenever handling semiconductor products. 9.2 esd-test the TH8080 is tested according mil883d (human body model). 9.3 emc the test on emc impacts is done according to iso 76 37-1 for power supply pins and iso 7637-3 for data- and signal pins. power supply pin vs: testpulse condition duration 1 t 1 = 5 s / u s = 100 v / t d = 2 ms 5000 pulses 2 t 1 = 0.5 s / u s = 100 v / t d = 0.05 ms 5000 pulses 3a/b u s = 150 v/ u s = 100 v burst 100ns / 10 ms / 90 ms break 1h 5 r i = 0.5 w , t d = 400 ms t r = 0.1 ms / u p +u s = 40 v 10 pulses every 1min signal pin bus: testpulse condition duration 1 t 1 = 5 s / u s = 100 v / t d = 2 ms 1000 pulses 2 t 1 = 0.5 s / u s = 100 v / t d = 0.05 ms 1000 pulses 3a/b u s = 150 v/ u s = 100 v burst 100ns / 10 ms / 90 ms break 1000 burst
TH8080 sololin transceiver TH8080 C datasheet page 22 of 23 3901008080 june 2009 rev 00 7 10. 10. 10. 10. assembly assembly assembly assembly information information information information this melexis device is classified and qualified reg arding soldering technology, solderability and mois ture sensitivity level, as defined in this specification , according to following test methods: ipc/jedec j-std-020 moisture/reflow sensitivity classification for nonh ermetic solid state surface mount devices (classification reflow profiles according to table 5-2) eia/jedec jesd22-a113 preconditioning of nonhermetic surface mount device s prior to reliability testing (reflow profiles according to table 2) cecc00802 standard method for the specification of surface mo unting components (smds) of assessed quality eia/jedec jesd22-b106 resistance to soldering temperature for through-hol e mounted devices en60749-15 resistance to soldering temperature for through-hol e mounted devices mil 883 method 2003 / eia/jedec jesd22-b102 solderability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature prof ile etc) additional classification and qualificatio n tests have to be agreed upon with melexis. the application of wave soldering for smds is allo wed only after consulting melexis regarding assuran ce of adhesive strength between device and board. based on melexis commitment to environmental respon sibility, european legislation (directive on the restriction of the use of certain hazardous substan ces, rohs) and customer requests, melexis has installed a roadmap to qualify their package famili es for lead free processes also. various lead free generic qualifications are runnin g, current results on request. for more information on melexis lead free statement see quality page at our website: http://www.melexis.com/html/pdf/mlxleadfree-stateme nt.pdf 11. 11. 11. 11. disclaimer disclaimer disclaimer disclaimer devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, s tatutory, implied, or by description regarding the information set forth herein or regarding the freed om of the described devices from patent infringemen t. melexis reserves the right to change specifications and prices at any time and without notice. therefo re, prior to designing this product into a system, it i s necessary to check with melexis for current infor mation. this product is intended for use in normal commerci al applications. applications requiring extended temperature range, unusual environmental requiremen ts, or high reliability applications, such as milit ary, medical life-support or life-sustaining equipment a re specifically not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall no t be liable to recipient or any third party for any dama ges, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequ ential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the t echnical data herein. no obligation or liability to recipien t or any third party shall arise or flow out of mel exis rendering of technical or other services. ? 2002 melexis nv. all rights reserved.
TH8080 sololin transceiver TH8080 C datasheet page 23 of 23 3901008080 june 2009 rev 00 7 your notes your notes your notes your notes for the latest version of this document. go to our website at www.melexis.com or for additional information contact melexis direc t: europe and japan: all other locations: phone: +32 1367 0495 phone: +1 603 223 2362 e-mail: sales_europe@melexis.com e-mail: sales_usa @melexis.com iso/ts16949 and iso14001 certified

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